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Solder paste inspection (SPI) is a critical step in the SMT assembly process for ensuring soldering quality. This article provides a detailed analysis of how SPI technology monitors solder paste printing quality through high-precision 3D measurement, a rigorous inspection standard system, and a systematic operational process. It also offers professional solutions for five common issues. The article further explains the application characteristics of SPI in various electronic manufacturing fields, highlighting the core value of this technology in quality assurance and process optimization.

This article provides a detailed analysis of the factors influencing PCB delivery cycles, including design complexity, raw material supply, production processes, equipment capabilities, order priority, and quality control. Delivery times for PCBs of different layer counts (e.g., 2-layer, 4-layer, 6-layer, and above) range from 2 days to 20 days, with urgent orders able to be expedited to 24–72 hours. As a professional PCB manufacturer, Topfast leverages advanced equipment, rigorous testing, and efficient service to help customers optimize production cycles, reduce costs, and enhance market competitiveness.

This article provides a detailed overview of Topfast’s professional PCB comprehensive testing system, covering three key stages: bare board testing, PCBA assembly testing, and reliability verification. The article explains the application and value of advanced testing technologies such as AOI, SPI, AXI, and ICT, demonstrating Topfast’s commitment to ensuring product quality through its testing capabilities. This article is suitable for engineers and procurement personnel interested in PCB reliability.

Topfast, a leading PCB manufacturer with 17 years of industry experience, specializes in high-precision circuit board design, production, and assembly services, serving clients such as Huawei, DJI, and Mitsubishi. The company operates a modern 20,000㎡ factory with over 1,000 professional staff, achieving a monthly production capacity of 100,000㎡. It offers a full range of solutions from HDI boards, high-frequency/high-speed boards to rigid-flex boards, with all products certified to UL, ROHS, and ISO9001 standards. With state-of-the-art equipment such as laser drilling and AOI/X-RAY full inspection, coupled with a team of seasoned technical experts, Topfast achieves the industry’s fastest turnaround times—12 hours for 2-layer boards and 96 hours for 12-layer boards—while also offering BOM cost optimization and 24/7 full-cycle service.

This guide explains ICT testing (In-Circuit Test), a cornerstone of PCBA quality control. It answers FAQs on testable components (resistors, ICs), compares ICT with AOI, and highlights benefits like cost reduction and defect prevention. Perfect for engineers optimizing production line testing.

This comprehensive guide explores PCT testing’s critical role in electronics manufacturing, covering its principles, equipment, and applications across industries. Learn how PCT evaluates moisture resistance in PCBs, prevents semiconductor failures like popcorn effect, and accelerates life testing. Compare PCT with AOI/ICT/FCT methods, understand key testing parameters (121°C/100%RH/2atm), and discover how it reduces development cycles while improving product reliability in automotive, medical, and aerospace applications.

This comprehensive guide explores the STM32F103C8T6 microcontroller in detail, covering its technical specifications, architecture, peripheral interfaces, and development ecosystem. The article provides valuable insights into minimum system design, performance optimization techniques, common troubleshooting solutions, and real-world applications. Whether you’re a beginner learning embedded systems or an experienced engineer working with STM32, this guide offers practical information about programming methods, hardware design considerations, and the microcontroller’s extensive capabilities in industrial, consumer, and IoT applications.

The core applications of AOI technology in SMT, semiconductor and automotive electronics, including how automated optical inspection works, industry pain point solutions (e.g. 3D SPI inline system), and how to achieve 99.5% defect detection rate through AI and MES integration.

PCB factory test including AOI, ICT and FCT test, working principle, implementation points and interrelationship, the establishment of a perfect PCBA test system to ensure product quality.

Reliability test methods for HDI printed circuit boards, including core technologies such as temperature cycling test, thermal stress test and high temperature/high humidity bias test. Comparatively analyze the differences in reliability between HDI boards and traditional multilayer boards, and provide professional solutions to three common problems. Professional PCB manufacturer, providing reference for electronic manufacturers on the reliability of HDI boards.