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impedance control

How to design impedance control for PCB?

PCB impedance control is a core technology in high-speed circuit design, directly affecting signal integrity and system performance. How to achieve perfect impedance matching through precise material selection, layer stack design, line width calculation, and process control to safeguard your electronic design.

PCB cost

What is the cost of manufacturing multilayer PCB?

The cost structure of PCB circuit boards, the impact of increased layer counts, material selection, and special processes on costs. By establishing a comprehensive cost model, an optimization strategy based on Six Sigma design was proposed, and industry cost trends were predicted.

PCB reliability

What are the different types of PCB electroplating?

Electroplating types (ENIG, Sn/Pb, OSP, etc.), their application scenarios, and comparative advantages. Solutions to eight common electroplating defects (such as uneven thickness, discoloration, etc.) through equipment optimization, process parameter adjustments, and improvements to pre- and post-treatment methods.

PCB Assembly

Which PCB company specializes in PCB assembly?

Topfast is a professional PCB assembly service provider offering a full range of services from component procurement, SMT placement, DIP post-soldering, to testing and assembly. We have advanced SMT production lines and a rigorous quality inspection system, supporting small to large-scale production runs to help customers shorten time to market and reduce supply chain risks.

PCB Assembly

Where can I get custom PCB made for my prototype?

In today’s rapidly developing electronics industry, finding a reliable PCB prototype manufacturer is crucial. Topfast is a one-stop PCB solutions expert with 17 years of experience, providing comprehensive services from design to assembly, with reliable quality and highly competitive prices.

PCB layer

How to scientifically select the number of PCB layers?

PCB layer selection involves analyzing key factors such as circuit complexity, frequency requirements, cost constraints, and signal integrity. Practical selection methods include pin density calculations and BGA adaptation rules, while also exploring advanced technologies such as HDI (high-density interconnect) and stacking optimization.

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