Superior thermal management with Alumina (Al2O3) and Aluminum Nitride (AlN) substrates for high-power, high-frequency, and aerospace applications.
Advanced ceramic substrates for the most demanding thermal and electrical requirements
The most cost-effective ceramic solution, offering excellent electrical insulation and mechanical strength for general high-temperature applications.
Ultimate thermal management with conductivity up to 170 W/m·K, ideal for high-power LED and power semiconductors.
Direct Plated Copper (DPC) for high-precision circuits and Direct Bonded Copper (DBC) for high-current power modules.
High/Low Temperature Co-fired Ceramics for complex multilayer ceramic structures with integrated passive components.
Our ceramic PCB manufacturing parameters at a glance
Compare our ceramic cores for different thermal and frequency requirements
| Property | FR-4Standard | Alumina96% Al2O3 | AlNAluminum Nitride | Silicon CarbideSiC |
|---|---|---|---|---|
| Thermal Conductivity | 0.25 W/m·K | 24 – 30 W/m·K | 150 – 170 W/m·K | 200+ W/m·K |
| Dielectric Constant | 4.2 – 4.6 | 9.0 – 10.0 | 8.5 – 9.0 | ~40 |
| Operating Temp | Up to 170°C | Up to 800°C | Up to 800°C | Up to 1000°C |
| CTE (Z-axis) | 50-70 ppm | 6-8 ppm | 4-5 ppm | 3.7 ppm |
| Durability | ||||
| Cost Level |
● Green = performance level · Amber = relative cost · Ceramic substrates offer ultimate thermal stability for high-power modules.
High-precision ceramic fabrication with state-of-the-art laser and plating tech
Selection of high-purity Alumina or Aluminum Nitride. Substrates undergo ultrasonic cleaning and surface treatment to ensure bonding quality.
Using CO2 or UV lasers to drill high-precision through-holes and scribe individual boards with micron-level accuracy.
Thin-film deposition (DPC) or high-temperature bonding (DBC) to create robust copper layers on the ceramic surface.
Fine-line circuit imaging followed by electroplating and high-end surface finishes like ENIG or Electrolytic Gold.
Custom ceramic PCB fabrication for high-power, medical, and aerospace applications
Power Lighting PCBs are printed circuit boards (PCBs) used in power and lighting equipment
Deep Ultraviolet (DUV) purifier PCBs are specialized circuit boards designed to power and control UV-C disinfection…
All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
According to the different needs, different processes, our factory can do ceramic circuit boards, can do the traditional process layer 2-8 layers, using low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC), can reach 10-20 layers, or even higher. In actual application we will choose according to the customer, the type of process required and demand.
Using the common ceramic circuit board thick film process, it is an advanced printed circuit board manufacturing technology with the advantages of easy multi-layer wiring, low cost, high temperature resistance, corrosion resistance, good mechanical strength, etc., which is widely used in the fields of electronics, communications, aerospace and so on.
We can't produce without gerber file, we produce based on Gerber. Or if you have any samples, we can also clone based on the samples, if so, we can send 3-5 samples to our company, and then evaluate the price of making samples for you.
The fastest delivery time we can support is 12 hours. 1 hour for prompt quotation. 4 hours for prompt engineering. This depends on your product requirements and quantity. In addition, lead time will be included in your quote.
As a global PCB manufacturer, our factories are located in Guangzhou, China and Shenzhen, China, utilizing the strengths of each region to best serve you.
Technical articles and industry trends on high-thermal PCB manufacturing
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Submit your designs for high-thermal Alumina or AlN boards. Our engineers provide expert DFM feedback for ceramic substrates.