PCB-produktionskapacitet

Omfattende tekniske parametre, materialer og produktionskapacitet til dine højteknologiske behov.

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Parameter Kobberfolie Standard Avanceret
Leder (sporbredde)
18 μm 0,125 mm 0,100 mm 0,075 mm
35 μm 0,200 mm 0,150 mm 0,150 mm
70 μm 0,300 mm 0,250 mm 0,250 mm
105 μm 0,350 mm 0,300 mm 0,300 mm
140 μm 0,400 mm 0,350 mm 0,350 mm
210 μm 0,500 mm 0,450 mm 0,450 mm
Sporafstand (mellemrum)
18 μm 0,125 mm 0,100 mm 0,075 mm
35 μm 0,200 mm 0,150 mm 0,150 mm
70 μm 0,300 mm 0,250 mm 0,250 mm
105 μm 0,350 mm 0,300 mm 0,300 mm
140 μm 0,400 mm 0,350 mm 0,350 mm
210 μm 0,500 mm 0,450 mm 0,450 mm
Ringformet ring
Standard - 0,10 mm 0,075 mm
HDI - 0,075 mm 0,05 mm
Mekanisk boring
Min. diameter - 0,20 mm 0,15 mm
Min hældning - 0,30 mm 0,25 mm
Billedformat - 8:1 10:1
Laser-mikrovias
Min. diameter - 0,10 mm 0,075 mm
Min hældning - 0,20 mm 0,15 mm
Stablede vias - Ja Ja
Forskudte vias - Ja Ja
HDI-strukturer
1+N+1 - Ja Ja
2+N+2 - Ja Ja
3+N+3 - På forespørgsel Ja
Pladens tykkelse
Minimum - 0,2 mm 0,15 mm
Standard rækkevidde - 0,4-3,2 mm 0,4-4,0 mm
Maksimum - 6,0 mm 8,0 mm
Tykkelse af kobber
Indre lag - 0,5-3 oz 0,5-6 oz
Yderste lag - 1-3 oz 1-6 oz
Lagantal
Standard - 1–16 1–24
Maksimum - - 32
Impedans-kontrol
Standard - ±10% ±7%
Præcision - ±7% ±5%
Loddemaske
Min Clearance - 0,10 mm 0,075 mm
Colors - Green/Red/Blue Any (Pantone)
Silkscreen
Min. linjebredde - 0,15 mm 0,10 mm
Board Dimensions & Accuracy
Min Size - 5×5 mm 5×5 mm
Max Size - 500×600 mm 600×1200 mm
Nøjagtighed - ±0.1 mm ±0.05 mm
Material Category Parameter / TG Beskrivelse Anvendelsessager
Standard & High TG (FR-4)
Materialetype FR-4 Standard FR-4 High TG FR-4 Low Loss
Manufacturers Shengyi / KB / NanYa Isola / Panasonic Rogers (Hybrid)
Tg (°C) 130–140 170–180 180+
DK (1GHz) 4.2–4.5 4.0–4.3 3.5–4.0
DF 0.015–0.02 0.010–0.015 0.005–0.010
Operating Temp -40 ~ 105°C -40 ~ 130°C -55 ~ 150°C
High Frequency (RF / Microwave)
Rogers Series RO4003C RO4350B RT5880
DK 3.38 3.48 2.20
DF 0.0027 0.0037 0.0009
Anvendelser RF / 5G Antennas High-speed Data Radar / Microwave
Specialty Substrates
Aluminum Base 0.5–3.0 mm, Thermal conductivity 1–3 W/mK
Copper Base High Power / LED Lighting / Automotive Power
Ceramic (Al2O3 / AlN) Ultra-high Temperature, Power RF
Flex PCB (FPC) PI / PET, 1–6 layers, dynamic flexing
Stiv-flex Hybrid construction, 2–12 layers
Overfladebehandlinger
HASL (SnPb) Standard Low cost solution Not for fine-pitch BGA
HASL Lead-Free RoHS-kompatibel Eco-friendly alternative Pitch > 0.5 mm
ENIG Ni 3–6 μm Au 0.05–0.1 μm Flat surface, most popular
ENEPIG Ni/Pd/Au Ultra-high reliability Gold wire bonding
OSP Organic Protection Omkostningseffektiv Limited shelf life
Nedsænket sølv Ag 0.1–0.3 μm Excellent conductivity Environmentally sensitive
Hårdt guld Au 0.5–2 μm Contact connectors High durability & cost
Designparameter Minimum Value Anbefalet Technical Note
Core Routing Guidelines
Min. sporbredde 0,075 mm ≥ 0.10 mm HDI capable of 0.05 mm
Min Spacing 0,075 mm ≥ 0.10 mm HDI capable of 0.05 mm
Min Annular Ring 0,05 mm ≥ 0.075 mm Standard through-hole
Min. borestørrelse 0,15 mm ≥ 0.20 mm Mechanical drilling range
Billedformat ≤ 10:1 8:1 optimal Affects plating reliability
BGA & Fine-Pitch Components
BGA Pitch 1.0 mm Standard Gennemgående hul via Traditional breakout
BGA Pitch 0.65 mm HDI Microvia-teknologi Increased layer count
BGA Pitch 0.4 mm Adv. HDI Via-in-pad (Vip-po) Filled & Capped Vias
Via-in-Pad Supported Resin filled Surface planarization required
High-Speed & Impedance
Differentielle par 100Ω / 90Ω ±10% std Tight tolerance ±5% avail
Single-Ended 50Ω Matched length Critical for SI analysis
Backdrill Supported Via stub removal Forbedrer signalintegriteten
Compliance & Quality Standards
IPC-klasse Klasse 2 Klasse 3 Industrial / Medical / Aero
Certificeringer UL / RoHS ISO 9001 / 14001 IATF 16949 (Automotive)

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