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Ce guide complet explore en détail le microcontrôleur STM32F103C8T6, couvrant ses spécifications techniques, son architecture, ses interfaces périphériques et son écosystème de développement.

Les principales applications de la technologie AOI dans les domaines du SMT, des semi-conducteurs et de l'électronique automobile, y compris le fonctionnement de l'inspection optique automatisée, les solutions aux problèmes de l'industrie (par exemple, le système SPI 3D en ligne) et la manière d'atteindre un taux de détection des défauts de 99,5 % grâce à l'intégration de l'intelligence artificielle et du système d'information de gestion.

Le test en usine des PCB comprend les tests AOI, ICT et FCT, le principe de fonctionnement, les points de mise en œuvre et les interrelations, la mise en place d'un système de test PCBA parfait pour garantir la qualité du produit.

Méthodes d'essai de fiabilité pour les cartes de circuits imprimés HDI, y compris les technologies de base telles que l'essai de cycle de température, l'essai de contrainte thermique et l'essai de polarisation à haute température/haute humidité.

High Density Interconnect (HDI) printed circuit boards are revolutionizing modern electronics by enabling smaller, faster and more reliable circuit designs. Whether it’s optimizing signal integrity, thermal management, or miniaturization, understanding HDI technology is critical to the next generation of PCB design.

PCBA is a key process for mounting electronic components onto printed circuit boards to form functional circuits, including the two main processes of Surface Mount Technology (SMT) and Through Hole Technology (THT). Understanding the production process, industry applications, and future trends of PCBA will help increase understanding of PCBA manufacturing and assembly.

PCB reliability test is the core link to ensure the quality of electronic products, covering electrical performance, mechanical strength, environmental adaptability and other aspects of the assessment. 16 key test methods, including conductivity test, voltage test, thermal stress test, salt spray test, etc., in-depth analysis of the purpose of the various tests, the principle and judging criteria.

PCB manufacturing process must be carried out in 8 categories of test methods, from basic visual inspection to high-end AXI inspection, analyze the advantages and disadvantages of various types of technology and applicable scenarios, for electronic product manufacturers to provide a complete PCB quality control program.

ELECOMP Tehran 2025 is Iran’s premier electronics trade show showcasing printed circuit boards, semiconductors, SMT and IoT solutions.With over 57,000 attendees in 2024, the show connects global suppliers with Iran’s growing ICT industry.

The PCB assembly process is a systematic manufacturing process of mounting electronic components onto printed circuit boards. Precise control of solder paste printing, high-speed placement of SMT components, temperature profile management for reflow soldering, multiple quality inspection methods, through-hole component assembly techniques, comprehensive functional testing strategies, and post-cleaning processes. Industry trends such as HDI technology, flexible electronics and smart manufacturing are also discussed.