Integrated 3D Design

Rigid-Flex Printed Circuit Boards

Hybrid PCBs combining rigid and flexible substrates for advanced 3D packaging

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Quality Standards & Certifications

Our commitment to excellence through international quality standards

IPC-6013

Class 3 Rigid-Flex Performance

IPC-2223

Sectional Design Standard

ISO 9001

Quality Management System

RoHS

Restriction of Hazardous Substances

UL 94V-0

Flammability Rating

IPC-A-600

Acceptability of Printed Boards

Rigid-Flex Configurations

Choose the right rigid-flex configuration for your application

Single-Sided Rigid-Flex PCB

Single-Sided Rigid-Flex

Basic rigid-flex construction with single conductive layer in flexible areas.

Cost-effective solution
Good flexibility
Simplified manufacturing
Reliable interconnections
Get Single-Sided Quote
Double-Sided Rigid-Flex PCB

Double-Sided Rigid-Flex

Two conductive layers in flex areas with via connections for increased density.

Higher circuit density
Better signal routing
Improved reliability
Via interconnections
Get Double-Sided Quote
Multilayer Rigid-Flex PCB

Multilayer Rigid-Flex

Advanced rigid-flex with 4+ layers for complex, high-density applications.

High-density interconnections
Enhanced EMI shielding
Power and ground planes
Complex circuit capability
Get Multilayer Quote
Bookbinder Rigid-Flex PCB

Bookbinder Rigid-Flex

Complex design with multiple rigid sections connected by flexible circuits in a book-like configuration.

3D packaging capability
Multiple rigid sections
Superior reliability
Space optimization
Get Bookbinder Quote

Material Options

Advanced materials for high-performance rigid-flex PCB construction

PI

Polyimide Flex

Standard polyimide flexible material with excellent thermal stability and flexibility.

  • Temp Range: -65°C to 260°C
  • Dielectric Constant: 3.4-3.5
  • Applications: Standard rigid-flex
FR-4

FR-4 Rigid

Standard rigid PCB material with good mechanical and electrical properties.

  • Temperature: 130-140°C
  • Dielectric Constant: 4.2-4.8
  • Applications: Rigid sections
LCP

Liquid Crystal Polymer

High-frequency material for RF and microwave rigid-flex applications.

  • Temp Range: -200°C to 240°C
  • Dielectric Constant: 2.9-3.2
  • Applications: RF, Microwave
Adh

Adhesives

Specialized adhesives for bonding rigid and flexible layers together.

  • Type: Acrylic, Epoxy
  • Bond Strength: High
  • Applications: Layer bonding

Manufacturing Process

Specialized manufacturing process for rigid-flex PCB production

01
Rigid-Flex Layer Preparation

Layer Preparation

Separate fabrication of rigid and flexible layers with precise material selection and cutting.

02
Rigid-Flex Layer Bonding

Layer Bonding

Precise alignment and bonding of rigid and flexible layers using specialized adhesives.

03
Rigid-Flex Drilling

Controlled Depth Drilling

Precision drilling through bonded layers with controlled depth for interconnections.

04
Rigid-Flex Coverlay Application

Coverlay & Stiffener

Application of flexible coverlay and rigid stiffeners for protection and mechanical support.

Technical Specifications

Our manufacturing capabilities for rigid-flex PCB production

2-16

Total Layers

Combined rigid and flex layers

0.1mm

Min Line/Space

Minimum trace width and spacing

0.15mm

Min Hole Size

Minimum drill size

±0.1mm

Bend Radius

Minimum dynamic bend radius

0.4-3.2mm

Board Thickness

Overall board thickness range

1oz-2oz

Copper Weight

Flexible area copper thickness

Key Benefits

Advantages of rigid-flex PCB technology over traditional solutions

Reduced Connectors

Eliminate interconnects and connectors, improving reliability and reducing points of failure.

Space Saving

3D packaging capability reduces overall package size and weight by up to 60%.

Improved Reliability

Elimination of solder joints and connectors increases system reliability and durability.

Enhanced Performance

Shorter signal paths and controlled impedance improve electrical performance.

Cost Reduction

Reduced assembly time, fewer components, and simplified installation lower total cost.

Design Freedom

Flexible design options enable innovative product designs not possible with rigid boards.

Rigid-Flex PCB Products

Professional rigid-flex PCB manufacturing for advanced applications

10-Layer Rigid-Flex PCB

10-Layer Rigid-Flex PCB

Technical specifications, application advantages, and Topfast's professional manufacturing capabilities for 10-layer rigid-flex boards. Topfast provides…

Rigid-Flex3D PCBAdvanced
4 Layer Rigid Flex PCB

4 Layer Rigid Flex PCB

The 4-layer rigid-flex PCB circuit board is a circuit board design that combines the characteristics…

Rigid-Flex3D PCBAdvanced
Metal Stiffener Rigid-Flex PCB

Metal Stiffener Rigid-Flex PCB

The metal-reinforced rigid-flex composite panel is an innovative structural board that combines high strength with…

Rigid-Flex3D PCBAdvanced

Design Guidelines

Key considerations for successful rigid-flex PCB design

Bend Area Design

  • Maintain minimum bend radius (10-100x material thickness)
  • Route traces perpendicular to bend line
  • Avoid placing vias in bend areas
  • Use curved traces instead of sharp corners

Transition Zones

  • Gradual transition between rigid and flex areas
  • Reinforce transition points with additional coverlay
  • Use tear stops at board edges
  • Consider mechanical stress relief

Layer Stackup

  • Symmetrical stackup for balanced construction
  • Consistent materials throughout stackup
  • Proper adhesive selection for bonding
  • Consider CTE matching between materials

Manufacturing Notes

  • Clearly mark rigid and flex areas
  • Specify stiffener requirements
  • Indicate bend direction and location
  • Include assembly instructions

FAQ

  • What certifications do PCB factories have?

    All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.

  • How many layers can your pcb rigid-flex boards do?

    Rigid zone: usually 4-20 layers (up to 30 layers), flexible zone: 1-8 layers (multi-layer flexible structure), can also do 6-12 layers of rigid-flex combination (e.g., 6 layers rigid + 2 layers flexible) typical structure of the board, the actual number of layers need to be verified by DFM simulation, more than 16 layers of the design need to be additionally assessed for the loss of yield (every additional 5 layers, the yield decreased by 8-12%).

  • Is it possible to copy the board? Can you provide the unit price of the batch afterward?

    We can copy the board, but we can't evaluate the batch quantity, and we can't offer the price directly, because we don't know the model and brand of the devices on the PCB board, and we need to give the corresponding price according to the later production process, the brand and model of the assembled electronic components, and the production quantity.

  • Rigid flex pcb quote

    Our pricing structure is transparent with no hidden fees. Our prices are among the most competitive in the world. In the case of PCBs, quotes can be made in as little as 10 minutes, based on the difficulty of the boards, the quoting time will be different.

  • Do you charge for shipping? How do you calculate it?

    Generally, we will ask the customer if he/she needs to quote the shipping price for his/her reference before quoting. If so, we will ask the courier company's price according to the address and zip code, and the weight of the product, and then quote the price.

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Technical articles and industry knowledge about rigid-flex PCB manufacturing

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