Description
Table of Contents
High-speed circuit boards are circuit boards used for high-speed signal transmission. They are specially designed to process high-frequency and high-rate electrical signals to ensure the accuracy and stability of data during high-speed transmission. Their main characteristics include high frequency performance, low loss, and excellent heat dissipation.
Definition & Key Features
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High-speed PCBs are specialized circuit boards designed for GHz-level signal transmission, featuring three core attributes:
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High-Frequency Performance: Supports mmWave bands (24- 100GHz) for 5G/6G communications
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Ultra-Low Loss: Insertion loss <0.3dB/inch@10GHz
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Efficient Thermal Management: Dedicated substrates with thermal conductivity ≥3W/(m·K)
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Application Matrix
Application Frequency Typical Material Special Process 5G AAU Modules 24-47GHz Rogers RO4835 Laser Drilling + HDI Stackup Data Center Switches 56Gbps PAM4 Megtron6 Ultra-Low Profile Copper Automotive Radar 77-81GHz Taconic RF-35 Embedded Capacitors/Resistors
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High-speed PCB board parameters
| Item | Rigid PCB |
| Max Layer | 60L |
| Inner Layer Min Trace/Space | 3/3mil |
| Out Layer Min Trace/Space | 3/3mil |
| Inner Layer Max Copper | 6oz |
| Out Layer Max Copper | 6oz |
| Min Mechanical Drilling | 0.15mm |
| Min Laser Drilling | 0.1mm |
| Aspect Ratio(Mechanical Drilling) | 20:1 |
| Aspect Ratio(Laser Drilling) | 1:1 |
| Press Fit Hole Ttolerance | ±0.05mm |
| PTH Tolerance | ±0.075mm |
| NPTH Tolerance | ±0.05mm |
| Countersink Tolerance | ±0.15mm |
| Board Thickness | 0.4-8mm |
| Board Thickness Tolerance(＜1.0mm) | ±0.1mm |
| Board Thickness Tolerance(≥1.0mm) | ±10% |
| Impedance Tolerance | Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω) |
| Differential：±5Ω(≤50Ω)，±7%(＞50Ω) | |
| Min Board Size | 10*10mm |
| Max Board Size | 22.5*30inch |
| Contour Tolerance | ±0.1mm |
| Min BGA | 7mil |
| Min SMT | 7*10mil |
| Surface Treatment | ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating |
| Solder Mask | Green,Black,Blue,Red,Matt Green |
| Min Solder Mask Clearance | 1.5mil |
| Min Solder Mask Dam | 3mil |
| Legend | White,Black,Red,Yellow |
| Min Legend Width/Height | 4/23mil |
| Strain Fillet Width | / |
| Bow & Twist | 0.3% |
Golden Rules for Design Optimization
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Reference Plane Specifications
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20H Rule: Ground plane edge recess ≥5× layer spacing
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3W Rule: Trace spacing ≥3× trace width
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Via Array Design Guidelines
Parameter Recommended Value Engineering Basis Ground Via Spacing λ/10@Max Frequency Prevents resonance Anti-Pad Size Via Diameter + 20mil Reduces capacitive discontinuity Back-Drilling Depth Target Layer + 2mil Eliminates stub effects -
Material Selection Guide
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High-Frequency Apps: Dk=3.5±0.05, Df<0.003
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High-Speed Digital: Dk=4.0-4.5, Df<0.01
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Cutting-Edge Technologies
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Advanced Interconnect Solutions
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Silicon Photonics: >1Tbps/mm² density
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Terahertz Substrates: >300GHz transmission window
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Design Methodology Evolution
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ML-Based Routing Optimization
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Quantum EM Simulation Algorithms
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Application of PCB
PCB application in consumer electronics, Aerospace, Telecom communication, military and defense, Industrial control, automotive industry.
Our Full-Capability Offerings
Advanced PCB Technologies
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Rigid-Flex PCBs: Seamless integration of rigid and flexible sections for 3D packaging
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Heavy Copper PCBs: Up to 20oz copper weight for high-power applications
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Flexible PCBs: Dynamic bending solutions with 500,000+ cycle endurance
Precision PCBA Services
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Standard PCBA: IPC-A-610 Class 3 certified assembly
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Flexible PCBA: Specialized processes for bendable assemblies
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High-Mix Prototyping: 24-hour quick-turn available
Engineering Design Support
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High-Speed PCB Design: Supporting 112G PAM4 interfaces
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DFM/DFA Analysis: 30% cost reduction through design optimization
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Signal Integrity Simulation: HyperLynx/PowerSI pre-verification
Specialized Manufacturing Capabilities
| Technology | Key Specifications | Typical Applications |
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| HDI Microvia | 50μm laser drills | 5G mmWave devices |
| Embedded Passives | 0201 discrete components | Aerospace avionics |
| RF Microwave | ±0.1mm impedance control | Radar systems |
Why Partner With Us?
✔ One-Stop Solution – From design to box-build assembly
✔ NPI Acceleration – 15-day standard lead time for prototypes
✔ Global Certifications – IATF 16949, ISO 13485, UL certified
Value-Added Services
• Free Design Review – Our engineers analyze your files within 4 business hours
• Cross-Platform Support – Accepts Altium, Cadence, PADS, and Mentor designs
• Supply Chain Integration – Component sourcing with 98% first-pass success rate
