Description
High-speed circuit boards are circuit boards used for high-speed signal transmission. They are specially designed to process high-frequency and high-rate electrical signals to ensure the accuracy and stability of data during high-speed transmission. Their main characteristics include high frequency performance, low loss, and excellent heat dissipation.
Definition & Key Features
High-speed PCB board parameters
| Item |
Rigid PCB |
| Max Layer |
60L |
| Inner Layer Min Trace/Space |
3/3mil |
| Out Layer Min Trace/Space |
3/3mil |
| Inner Layer Max Copper |
6oz |
| Out Layer Max Copper |
6oz |
| Min Mechanical Drilling |
0.15mm |
| Min Laser Drilling |
0.1mm |
| Aspect Ratio(Mechanical Drilling) |
20:1 |
| Aspect Ratio(Laser Drilling) |
1:1 |
| Press Fit Hole Ttolerance |
±0.05mm |
| PTH Tolerance |
±0.075mm |
| NPTH Tolerance |
±0.05mm |
| Countersink Tolerance |
±0.15mm |
| Board Thickness |
0.4-8mm |
| Board Thickness Tolerance(＜1.0mm) |
±0.1mm |
| Board Thickness Tolerance(≥1.0mm) |
±10% |
| Impedance Tolerance |
Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω) |
| Differential：±5Ω(≤50Ω)，±7%(＞50Ω) |
| Min Board Size |
10*10mm |
| Max Board Size |
22.5*30inch |
| Contour Tolerance |
±0.1mm |
| Min BGA |
7mil |
| Min SMT |
7*10mil |
| Surface Treatment |
ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating |
| Solder Mask |
Green,Black,Blue,Red,Matt Green |
| Min Solder Mask Clearance |
1.5mil |
| Min Solder Mask Dam |
3mil |
| Legend |
White,Black,Red,Yellow |
| Min Legend Width/Height |
4/23mil |
| Strain Fillet Width |
/ |
| Bow & Twist |
0.3% |
Golden Rules for Design Optimization
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Reference Plane Specifications
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Via Array Design Guidelines
| Parameter |
Recommended Value |
Engineering Basis |
| Ground Via Spacing |
λ/10@Max Frequency |
Prevents resonance |
| Anti-Pad Size |
Via Diameter + 20mil |
Reduces capacitive discontinuity |
| Back-Drilling Depth |
Target Layer + 2mil |
Eliminates stub effects |
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Material Selection Guide
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High-Frequency Apps: Dk=3.5±0.05, Df<0.003
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High-Speed Digital: Dk=4.0-4.5, Df<0.01
Cutting-Edge Technologies
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Advanced Interconnect Solutions
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Design Methodology Evolution
Application of PCB
PCB application in consumer electronics, Aerospace, Telecom communication, military and defense, Industrial control, automotive industry.
Our Full-Capability Offerings
Advanced PCB Technologies
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Rigid-Flex PCBs: Seamless integration of rigid and flexible sections for 3D packaging
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Heavy Copper PCBs: Up to 20oz copper weight for high-power applications
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Flexible PCBs: Dynamic bending solutions with 500,000+ cycle endurance
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Standard PCBA: IPC-A-610 Class 3 certified assembly
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Flexible PCBA: Specialized processes for bendable assemblies
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High-Mix Prototyping: 24-hour quick-turn available
Engineering Design Support
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High-Speed PCB Design: Supporting 112G PAM4 interfaces
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DFM/DFA Analysis: 30% cost reduction through design optimization
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Signal Integrity Simulation: HyperLynx/PowerSI pre-verification
Specialized Manufacturing Capabilities
| Technology |
Key Specifications |
Typical Applications |
| HDI Microvia |
50μm laser drills |
5G mmWave devices |
| Embedded Passives |
0201 discrete components |
Aerospace avionics |
| RF Microwave |
±0.1mm impedance control |
Radar systems |
Why Partner With Us?
✔ One-Stop Solution – From design to box-build assembly
✔ NPI Acceleration – 15-day standard lead time for prototypes
✔ Global Certifications – IATF 16949, ISO 13485, UL certified
Value-Added Services
• Free Design Review – Our engineers analyze your files within 4 business hours
• Cross-Platform Support – Accepts Altium, Cadence, PADS, and Mentor designs
• Supply Chain Integration – Component sourcing with 98% first-pass success rate