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PCB manufacturing process must be carried out in 8 categories of test methods, from basic visual inspection to high-end AXI inspection, analyze the advantages and disadvantages of various types of technology and applicable scenarios, for electronic product manufacturers to provide a complete PCB quality control program.

ELECOMP Tehran 2025 is Iran’s premier electronics trade show showcasing printed circuit boards, semiconductors, SMT and IoT solutions.With over 57,000 attendees in 2024, the show connects global suppliers with Iran’s growing ICT industry.

The PCB assembly process is a systematic manufacturing process of mounting electronic components onto printed circuit boards. Precise control of solder paste printing, high-speed placement of SMT components, temperature profile management for reflow soldering, multiple quality inspection methods, through-hole component assembly techniques, comprehensive functional testing strategies, and post-cleaning processes. Industry trends such as HDI technology, flexible electronics and smart manufacturing are also discussed.

Comprehensive analysis of core technology methods in PCB assembly, including through-hole mounting (THT), surface mounting (SMT) and hybrid mounting technologies. It introduces the process principles, equipment requirements, comparative advantages and disadvantages, and typical application scenarios of each technology, and analyzes the complete assembly process from solder paste printing to final inspection.

This comprehensive guide explores through-hole PCB assembly (THT), covering key benefits, technical processes, comparisons with SMT, and expert solutions to 5 common problems. As PCB assembly specialists, we examine through-hole technology’s unique value in mechanical strength, power handling, and reliability while providing practical recommendations for selecting the optimal assembly method for your project.

This comprehensive guide explores PCB fundamentals, from basic single-layer boards to advanced HDI designs, covering key materials like FR-4, aluminum, and ceramic substrates. We detail the complete manufacturing workflow, essential certifications (UL, ISO 9001/14001, IATF 16949), and diverse applications in consumer electronics, 5G networks, automotive systems, and aerospace. The article highlights technical specifications, industry standards, and emerging trends like flexible circuits and high-density interconnects, providing engineers and procurement professionals with critical insights for PCB selection and implementation.