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Innovative designs such as high-density interconnect (HDI) for IoT PCBs, micro vias, and multi-chip modules (MCM) address the challenges of miniaturization, high performance, and reliability in traditional PCBs, and propose a comprehensive optimization solution from design to manufacturing.

PCB Design Spacing Guidelines for Optimal Manufacturing 1. Trace Design Specifications Minimum Trace Width: 5mil (0.127mm) Trace Spacing: 5mil (0.127mm) minimum Board Edge Clearance: 0.3mm (20mil) 2. Via Design Requirements Hole Size: 0.3mm (12mil) minimum Pad Annular Ring: 6mil (0.153mm) minimum Via-to-Via Spacing: 6mil edge-to-edge Board Edge Clearance: 0.508mm (20mil) 3. PTH (Plated Through-Hole) Specifications […]

What are PCB trace width and trace spacing? In printed circuit board (PCB) design, trace width and trace spacing are two fundamental yet critical parameters: 1. Industry Standard Minimum Trace Width and Spacing 1.1 Conventional Process Capabilities 1.2 Advanced Processes (HDI) 1.3 Extreme Challenges 2. Four Key Factors Influencing Trace Width/Spacing Selection 2.1 Current Carrying […]

Printed circuit boards (PCBs) are core components of electronic devices, and the sophistication of their manufacturing processes directly determines product performance, reliability, and market competitiveness. The four key technologies of modern, efficient PCB manufacturing processes are panelization, modular production, automation and intelligence, and special process optimization. As an industry leader, Topfast provides professional PCB solutions […]

The design purposes, electrical performance impacts, and inspection methods of unfilled solder pads (exposed copper areas) on PCBs, covering key knowledge points such as test point functions, signal integrity risks, and X-ray inspection technology, comply with industry standards such as IPC-610, and provide assistance for PCB design and manufacturing processes.

How to Calculate PCB Impedance? Calculating PCB impedance ensures signal integrity, especially for high-speed and RF circuits. 1. Determine PCB Stackup & Geometry 2. Identify Dielectric Constant (Dk or εᵣ) 3. Choose Impedance Calculation Method Microstrip (outer layer trace over ground plane): Stripline (inner layer between two ground planes): Differential Pair: Requires spacing (S) between […]