IPC Issues Call for Participation for Electronics Materials Forum

Apr. 02, 2019

IPC−Association Connecting Electronics Industries invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

The content of the IPC Electronics Materials Forum will focus on materials for board fabrication, assembly, and post-assembly protection with an emphasis on the emerging technologies that challenge our existing materials set. Developments needed for the future will be addressed, and interactive panels will extend an open forum to discuss solutions to these challenges.

IPC is seeking presentations on emerging technologies challenging existing material sets, as well as the following topics of interest:

Substrate Materials:

● Novel board laminates

● Surface finishes

● Solder mask advancements

● Flexible/wearable circuits

● HDI developments


Assembly Materials:

● New solder alloys

● Flux development

● Cleaning chemistries

● Assembly process strategies

● Thermal interface solutions


Protective Materials:

● Cleaning chemistries

● Conformal coatings

● Adhesive

● Underfills

“While many future technologies can be envisioned, they cannot be fully developed without the materials and processes to manufacture them,” said Brook Sandy-Smith, IPC technical education program manager, “this conference is ideal for engineers and managers that procure materials or want to understand advancements in materials for the board, assembly, components, and protective layers.”


About IPC

IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000-member company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Address of Plant

Dongguan:

No.1, Southwest Fifth Street, Southwest Industrial Zone, Shijie Town, Dongguan City, Guangdong Province, China.

Shenzhen:

Building C, BaiShiXia Industrial Zone, FuYong High-Tech Park, Baoan District, ShenZhen city, Guangdong province, China.

Jiangmen:

No.268 Building 1&3,Waihai Town Qinglan Road, Jianghai District, Jiangmen City, Guangdong Province, China.