High Precision PCB Fabrication and PCBA for Semiconductor Applications
We provide advanced PCB fabrication services for semiconductor applications, including HDI PCB manufacturing, fine line processing, and high-frequency material support.
High-density interconnect PCB with fine trace and multilayer capability.
Support for Rogers and other advanced substrates for high-speed signals.
Precision microvia technology for semiconductor PCB requirements.
Support for ultra-small components and chip-level assembly.
Support for complex semiconductor packaging requirements.
AOI, X-ray, and functional testing ensure product reliability.
We provide engineering support across both fabrication and assembly stages.
| capacità | disciplinare |
|---|---|
| Tipo di PCB | HDI / High Frequency |
| Fabbricazione | Multilayer / Microvia / Fine Line |
| Montaggio | SMT / Advanced Packaging |
| Ispezione | AOI, X-Ray, Functional Test |
| domanda | Chip Testing / Packaging |
PCB solutions for semiconductor testing systems.
Support for advanced IC packaging technologies.
PCB for high-frequency and high-speed applications.
Fabrication + Assembly · High Precision · Reliable Quality
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