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PCB Solder Mask Design

Six Common Solder Mask Mistakes Every PCB Designer Should Know

Solder mask design is crucial for PCB reliability. This article covers 6 common errors: insufficient clearance, opening inaccuracies, misalignment, weak solder dams, silkscreen conflicts, and poor testability design. It explains root causes and provides solutions for both standard and high-frequency/high-voltage designs. Includes actionable checklist for better manufacturability.

DFM

PCB Design Must-Check: 5 Critical DFM Issues and How to Avoid Them

This article details the five core DFM issues in PCB design: thermal management, annular rings, board edge clearance, solder mask application, and copper handling. It clarifies the fundamental distinctions between DFM and DRC, providing a full-process checklist and practical parameters. The article emphasizes that early collaboration with manufacturers like TOPFAST can significantly improve yield, reduce costs, and achieve seamless integration from design to manufacturing.

DFM

Complete Guide to PCB Design for Manufacturability (DFM)

This comprehensive guide covers essential PCB DFM principles including layout specifications, component spacing requirements, and trace width optimization. It details SMT/DIP placement guidelines, manufacturing processes, and DFM/DFT integration, plus 5 key FAQs for practical implementation.

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