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X-ray inspection in PCB manufacturing visualizes internal defects like voids and misalignments. While limited in detecting external issues, it effectively complements AOI and electrical testing for comprehensive quality control.

AOI in PCB manufacturing uses optical imaging to detect defects like shorts and misalignment. While effective for surface flaws, it cannot inspect hidden solder joints. AOI is a critical component within a broader quality control system, working alongside other tests to ensure comprehensive PCB reliability.

This guide explains PCB quality and reliability, detailing common manufacturing defects, key IPC standards, essential reliability testing methods, and best practices to ensure long-term circuit board performance.

This guide outlines key IPC standards like IPC-A-600 and IPC-6012 for PCB quality. It explains acceptance criteria and their direct implications for manufacturing reliability and compliance.

This article explains key PCB reliability tests like thermal cycling, mechanical stress, and electrical testing, detailing how they predict the board’s long-term performance and durability.

This article outlines common PCB manufacturing defects, analyzes their root causes, and provides preventive strategies through optimized design, material selection, and strict process control.