Produktionskapacitet för kretskort

Omfattande tekniska parametrar, material och tillverkningskapacitet för dina högteknologiska behov.

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Parameter Kopparfolie Standard Avancerad
Ledare (spårbredd)
18 μm 0,125 mm 0,100 mm 0,075 mm
35 μm 0,200 mm 0,150 mm 0,150 mm
70 μm 0,300 mm 0,250 mm 0,250 mm
105 μm 0,350 mm 0,300 mm 0,300 mm
140 μm 0,400 mm 0,350 mm 0,350 mm
210 μm 0,500 mm 0,450 mm 0,450 mm
Avstånd mellan spår (Gap)
18 μm 0,125 mm 0,100 mm 0,075 mm
35 μm 0,200 mm 0,150 mm 0,150 mm
70 μm 0,300 mm 0,250 mm 0,250 mm
105 μm 0,350 mm 0,300 mm 0,300 mm
140 μm 0,400 mm 0,350 mm 0,350 mm
210 μm 0,500 mm 0,450 mm 0,450 mm
Ringformad ring
Standard - 0,10 mm 0,075 mm
HDI - 0,075 mm 0,05 mm
Mekanisk borrning
Min Diameter - 0,20 mm 0,15 mm
Min pitch - 0,30 mm 0,25 mm
Aspect-förhållande - 8:1 10:1
Laser mikrovias
Min Diameter - 0,10 mm 0,075 mm
Min pitch - 0,20 mm 0,15 mm
Staplade vior - Ja Ja
Förskjutna vior - Ja Ja
HDI-strukturer
1+N+1 - Ja Ja
2+N+2 - Ja Ja
3+N+3 - På begäran Ja
Brädans tjocklek
Minimum - 0,2 mm 0,15 mm
Standardområde - 0,4-3,2 mm 0,4-4,0 mm
Maximalt - 6,0 mm 8,0 mm
Koppartjocklek
Inre skikt - 0,5-3 oz 0,5-6 oz
Yttre lager - 1-3 uns 1-6 uns
Antal lager
Standard - 1–16 1–24
Maximalt - - 32
Impedansreglering
Standard - ±10% ±7%
Precision - ±7% ±5%
Lödmask
Min Clearance - 0,10 mm 0,075 mm
Colors - Green/Red/Blue Any (Pantone)
Silkscreen
Min Linjebredd - 0,15 mm 0,10 mm
Board Dimensions & Accuracy
Min Size - 5×5 mm 5×5 mm
Max Size - 500×600 mm 600×1200 mm
Noggrannhet - ±0.1 mm ±0.05 mm
Material Category Parameter / TG Beskrivning Tillämpningsfall
Standard & High TG (FR-4)
Materialtyp FR-4 Standard FR-4 High TG FR-4 Low Loss
Manufacturers Shengyi / KB / NanYa Isola / Panasonic Rogers (Hybrid)
Tg (°C) 130–140 170–180 180+
DK (1GHz) 4.2–4.5 4.0–4.3 3.5–4.0
DF 0.015–0.02 0.010–0.015 0.005–0.010
Operating Temp -40 ~ 105°C -40 ~ 130°C -55 ~ 150°C
High Frequency (RF / Microwave)
Rogers Series RO4003C RO4350B RT5880
DK 3.38 3.48 2.20
DF 0.0027 0.0037 0.0009
Tillämpningar RF / 5G Antennas High-speed Data Radar / Microwave
Specialty Substrates
Aluminum Base 0.5–3.0 mm, Thermal conductivity 1–3 W/mK
Copper Base High Power / LED Lighting / Automotive Power
Ceramic (Al2O3 / AlN) Ultra-high Temperature, Power RF
Flex PCB (FPC) PI / PET, 1–6 layers, dynamic flexing
Rigid-Flex Hybrid construction, 2–12 layers
Ytbehandlingar
HASL (SnPb) Standard Low cost solution Not for fine-pitch BGA
HASL Lead-Free RoHS-kompatibel Eco-friendly alternative Pitch > 0.5 mm
ENIG Ni 3–6 μm Au 0.05–0.1 μm Flat surface, most popular
ENEPIG Ni/Pd/Au Ultra-high reliability Gold wire bonding
OSP Organic Protection Kostnadseffektivt Limited shelf life
Fördjupning Silver Ag 0.1–0.3 μm Excellent conductivity Environmentally sensitive
Hårt guld Au 0.5–2 μm Contact connectors High durability & cost
Dimensioneringsparameter Minimum Value Rekommenderas Technical Note
Core Routing Guidelines
Min spårbredd 0,075 mm ≥ 0.10 mm HDI capable of 0.05 mm
Min Spacing 0,075 mm ≥ 0.10 mm HDI capable of 0.05 mm
Min Annular Ring 0,05 mm ≥ 0.075 mm Standard through-hole
Min borrstorlek 0,15 mm ≥ 0.20 mm Mechanical drilling range
Aspect-förhållande ≤ 10:1 8:1 optimal Affects plating reliability
BGA & Fine-Pitch Components
BGA Pitch 1.0 mm Standard Genomgående hål via Traditional breakout
BGA Pitch 0.65 mm HDI Microvia-teknik Increased layer count
BGA Pitch 0.4 mm Adv. HDI Via-in-pad (Vip-po) Filled & Capped Vias
Via-in-Pad Supported Resin filled Surface planarization required
High-Speed & Impedance
Differentiella par 100Ω / 90Ω ±10% std Tight tolerance ±5% avail
Single-Ended 50Ω Matched length Critical for SI analysis
Backdrill Supported Via stub removal Förbättrar signalintegriteten
Compliance & Quality Standards
IPC-klass Klass 2 Klass 3 Industrial / Medical / Aero
Certifieringar UL / RoHS ISO 9001 / 14001 IATF 16949 (Automotive)

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