PCB Hardware Guide

PCB Guide

1. PCB Classification System

Classification by Structural Layers

TypeCharacteristicsApplication Scenarios
Single-sided BoardWiring on one side only, low cost, simple designBasic circuits, such as toys, simple home appliances
Double-sided BoardWiring on both sides, connected through vias, higher wiring densityPower modules, industrial control equipment
Multi-layer Board4 or more conductive layers laminated, high-density wiring, strong anti-interferenceComplex devices like mobile phones, computer motherboards

Classification by Base Material

TypeCore MaterialsCharacteristics & Applications
Rigid BoardFR-4 glass fiber epoxy resinFixed equipment, such as TVs, desktop computers
Flexible Board (FPC)Polyimide (PI)Applications requiring bending, like foldable screens, camera modules
Rigid-Flex BoardRigid + flexible composite materialsAerospace, medical devices, balancing strength and flexibility
Special Substrate BoardsRogers high-frequency boards, aluminum substrates, ceramic substratesHigh-frequency circuits, high heat dissipation requirements, high-temperature environments

Classification by Special Processes

  • HDI PCB: Micro-via and blind/buried via technology, fine wiring, suitable for smartphones, wearable devices
  • Metal Substrate: Excellent thermal performance, essential for power devices
  • High-Frequency High-Speed Board: Low dielectric constant (Dk), low loss (Df), suitable for RF/microwave circuits
high frequency PCBs

2. Detailed Analysis of Core Electronic Components

2.1 Main Control Chip Family

Classification and Characteristics Comparison Table

Chip TypeCore FeaturesTypical Applications
MCUIntegrated CPU, memory, peripherals, small size, low powerRemote controls, sensors, embedded systems
MPUPowerful CPU core, requires external memoryPCs, servers, smartphones
SoCHighly integrated, processes digital/analog mixed signalsTablets, smartwatches, drones
DSPProfessional digital signal processing capabilityReal-time image processing, motion control
AI ChipDedicated AI algorithm accelerationVoice recognition, image recognition
FPGAProgrammable logic gate arrayFlexible logic control, signal processing

Function Matrix

  • System Control: Coordinates hardware resources, implements overall control
  • Data Processing: Processes sensor data, executes control algorithms
  • Communication Coordination: Ensures reliable communication between systems
  • Safety Protection: Overload protection, short circuit protection, and emergency shutdown
  • Energy Management: Optimizes operating parameters, improves energy efficiency

2.2 Driver Chip System

Motor Drive Specialization

  • Stepper Motor Drive: A4988, DRV8825 (precise position control)
  • DC Motor Drive: L298N, L293D (speed and direction control)
  • Brushless Motor Drive: DRV10983 (high-efficiency motor control)
  • Servo Motor Drive: Industrial-grade precision closed-loop control

Display and Power Drive

  • LCD/OLED Drive: ILI9341, SSD1306 (display control)
  • LED Drive: Constant current/PWM dimming technology
  • Power Management: DC-DC conversion, linear regulation

2.3 Power Management Chips

Classification Architecture

Power Management Chips
├── AC/DC Conversion Chips (AC to DC)
├── DC/DC Conversion Chips
│   ├── Boost Converter
│   ├── Buck Converter
│   └── Buck-Boost Converter
├── Linear Regulators (LDO)
├── Battery Management Chips
├── Protection Chips (OVP/OCP/OTP)
├── Fast Charging Protocol Chips
└── PFC Power Factor Correction Chips

Key Technical Parameters

  • Conversion Efficiency: >90% (high-efficiency design)
  • Ripple Noise: <10mV (precision applications)
  • Load Regulation: ±1% (stable output)
  • Temperature Range: -40℃~125℃ (industrial grade)
pcb

2.4 Passive Component Technical Specifications

Resistor Technical Indicators

  • Package Specifications: 0201, 0402, 0603, 0805 (SMD resistors)
  • Accuracy Grades: ±1%, ±5%, ±10%
  • Special Types: Thermistors (NTC/PTC), varistors, photoresistors

Capacitor Technology System

Classification Application Table

Capacitor TypeCharacteristicsApplication Scenarios
Electrolytic CapacitorLarge capacity, polarizedPower filtering, energy storage
Ceramic Capacitor (MLCC)Non-polarized, good high-frequency characteristicsDecoupling, high-frequency filtering
Film CapacitorHigh stability, low lossPrecision timing, audio circuits

Capacity Conversion System
1F = 10³mF = 10⁶μF = 10⁹nF = 10¹²pF

Inductors and Crystal Oscillators

  • Inductor Functions: Energy storage, filtering, impedance matching
  • Crystal Oscillator Functions: Clock signal generation, timing control, reference
  • Key Parameters: Inductance value (H), quality factor Q, self-resonant frequency

2.5 Semiconductor Discrete Devices

Diode Technical Characteristics

  • Rectifier Diodes: AC to DC conversion
  • Zener Diodes: Reverse breakdown voltage regulation
  • Schottky Diodes: Low forward voltage drop, high-speed switching
  • LEDs: Visible/IR light emission

Transistor Technology Matrix

BJT Operating States

  • Cut-off Region: Ib=0, completely off
  • Active Region: Ic=β×Ib, linear amplification
  • Saturation Region: Fully on, switching function

MOSFET Advantages

  • Voltage-controlled device, simple drive
  • Fast switching speed, high efficiency
  • Low on-resistance, small power loss

3. Connector Connection Technology

Structural Classification System

Circular Connectors

  • Characteristics: Excellent sealing, vibration resistance
  • Applications: Harsh industrial environments

Rectangular Connectors

  • Characteristics: High density, multi-signal transmission
  • Applications: Consumer electronics, communication equipment

Board-to-Board Connectors

  • FPC Connectors: Flexible circuit connections
  • Board-to-Board: High-density inter-board connections

Professional Application Connectors

High-Speed Connectors

  • Impedance Matching: 50Ω/75Ω standards
  • Crosstalk Control: <-40dB@10GHz
  • Insertion Loss Index: <0.5dB/inch

RF Connectors

  • SMA/BNC Interfaces: RF signal transmission
  • Characteristic Impedance: 50Ω standard
  • Frequency Range: DC~18GHz

Fiber Optic Connectors

  • LC/SC/ST Interfaces: Optical signal transmission
  • Insertion Loss: <0.3dB
  • Return Loss: >50dB
PCBA

4. Industry Professional Terminology

PCB Manufacturing Terminology

  • HDI: High-Density Interconnect
  • Impedance Control: ±10% tolerance
  • ENIG/HASL: Surface finish processes
  • Blind/Buried Vias: Special via structures in multi-layer boards

Component Packaging Terminology

  • SMD: Surface Mount Device
  • DIP: Dual In-line Package
  • QFP/BGA: High-density packaging forms

Measurement Unit System

  • Resistance: Ω, kΩ, MΩ
  • Capacitance: pF, nF, μF, F
  • Inductance: nH, μH, mH, H

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