High-Temperature Performance

Ceramic Printed Circuit Boards

Advanced ceramic substrates for high-power, high-frequency, and extreme environment applications

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Quality Standards & Certifications

Our commitment to excellence through international quality standards

IPC-6012

Class 3 Performance

ISO 9001

Quality Management System

RoHS

Restriction of Hazardous Substances

UL 94V-0

Flammability Rating

AS9100

Aerospace Quality Management

Ceramic PCB Technologies

Advanced ceramic PCB technologies for demanding applications

Alumina Ceramic PCB

Alumina Ceramic PCB (Al₂O₃)

Most common ceramic substrate with excellent thermal and electrical properties.

High thermal conductivity
Excellent electrical insulation
Good mechanical strength
Cost-effective ceramic option
Get Alumina Quote
Aluminum Nitride Ceramic PCB

Aluminum Nitride (AlN)

Superior thermal conductivity ceramic for high-power applications.

Exceptional thermal conductivity
Low thermal expansion
Excellent dielectric strength
High power handling
Get AlN Quote
Beryllium Oxide Ceramic PCB

Beryllium Oxide (BeO)

Highest thermal conductivity ceramic for extreme thermal management.

Highest thermal conductivity
Excellent RF performance
Low dielectric loss
Superior thermal shock resistance
Get BeO Quote
LTCC Ceramic PCB

Low Temperature Co-fired Ceramic (LTCC)

Multilayer ceramic technology for high-frequency and 3D integration.

3D integration capability
Excellent high-frequency performance
High component density
Embedded passive components
Get LTCC Quote

Ceramic Material Comparison

Key properties of different ceramic substrate materials

Property
Alumina (96%)
Aluminum Nitride
Beryllium Oxide
LTCC
Thermal Conductivity (W/mK)
24-28
170-200
250-300
2-5
Dielectric Constant @ 1MHz
9.0-9.5
8.5-9.0
6.5-7.0
5.0-8.0
CTE (ppm/°C)
6.5-7.5
4.5-5.5
7.5-8.5
5.0-7.0
Flexural Strength (MPa)
300-350
300-350
200-250
150-200
Max Operating Temp (°C)
1500
1800
1800
850

Ceramic PCB Manufacturing

Specialized manufacturing processes for ceramic circuit boards

01
Ceramic Substrate Preparation

Substrate Preparation

Precision cutting and surface preparation of ceramic substrates with laser or diamond tools.

02
Ceramic Metallization

Metallization

Thick film or thin film metallization processes using screen printing, sputtering, or plating.

03
Ceramic Firing Process

Firing Process

High-temperature firing in controlled atmosphere furnaces to bond metallization layers.

04
Ceramic Laser Processing

Laser Processing

Precision laser cutting, drilling, and scribing for vias, cavities, and final dimensions.

Technical Capabilities

Our manufacturing capabilities for ceramic PCB production

0.05mm

Min Line Width

Minimum trace width on ceramic

0.05mm

Min Line Spacing

Minimum trace spacing

0.1mm

Min Via Size

Minimum via diameter

0.1mm

Via Pitch

Minimum via center spacing

0.25-1.5mm

Substrate Thickness

Available ceramic thickness

Ceramic PCB Advantages

Key advantages over traditional PCB materials

🔥

High Thermal Conductivity

Superior heat dissipation (10-20x better than FR-4)

💎

Thermal Stability

Stable performance from -55°C to +850°C

Excellent Insulation

High dielectric strength and low loss

🏗️

Mechanical Strength

High flexural strength and rigidity

🛡️

Chemical Resistance

Resistant to solvents, acids, and bases

Ceramic PCB Products

Advanced ceramic PCB manufacturing for extreme applications

Power illumination PCB

Power illumination PCB

Power Lighting PCBs are printed circuit boards (PCBs) used in power and lighting equipment

CeramicHigh-TempThermal
Deep Ultraviolet (DUV) purifier PCBs

Deep Ultraviolet (DUV) purifier PCBs

Deep Ultraviolet (DUV) purifier PCBs are specialized circuit boards designed to power and control UV-C disinfection…

CeramicHigh-TempThermal

FAQ

  • What certifications do PCB factories have?

    All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.

  • How many layers is a Ceramic PCB?

    According to the different needs, different processes, our factory can do ceramic circuit boards, can do the traditional process layer 2-8 layers, using low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC), can reach 10-20 layers, or even higher. In actual application we will choose according to the customer, the type of process required and demand.

  • Commonly used ceramic circuit board processes

    Using the common ceramic circuit board thick film process, it is an advanced printed circuit board manufacturing technology with the advantages of easy multi-layer wiring, low cost, high temperature resistance, corrosion resistance, good mechanical strength, etc., which is widely used in the fields of electronics, communications, aerospace and so on.

  • Is it possible to produce a ceramic PCB with only a picture and no Gerber file?

    We can't produce without gerber file, we produce based on Gerber. Or if you have any samples, we can also clone based on the samples, if so, we can send 3-5 samples to our company, and then evaluate the price of making samples for you.

  • What is your delivery time?

    The fastest delivery time we can support is 12 hours. 1 hour for prompt quotation. 4 hours for prompt engineering. This depends on your product requirements and quantity. In addition, lead time will be included in your quote.

  • Where are your circuit boards manufactured?

    As a global PCB manufacturer, our factories are located in Guangzhou, China and Shenzhen, China, utilizing the strengths of each region to best serve you.

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