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Ceramic Printed Circuit Boards
Advanced ceramic substrates for high-power, high-frequency, and extreme environment applications
Get Instant QuoteQuality Standards & Certifications
Our commitment to excellence through international quality standards
IPC-6012
Class 3 Performance
ISO 9001
Quality Management System
RoHS
Restriction of Hazardous Substances
UL 94V-0
Flammability Rating
AS9100
Aerospace Quality Management
Ceramic PCB Technologies
Advanced ceramic PCB technologies for demanding applications
Alumina Ceramic PCB (Al₂O₃)
Most common ceramic substrate with excellent thermal and electrical properties.
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High thermal conductivity
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Excellent electrical insulation
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Good mechanical strength
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Cost-effective ceramic option
Aluminum Nitride (AlN)
Superior thermal conductivity ceramic for high-power applications.
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Exceptional thermal conductivity
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Low thermal expansion
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Excellent dielectric strength
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High power handling
Beryllium Oxide (BeO)
Highest thermal conductivity ceramic for extreme thermal management.
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Highest thermal conductivity
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Excellent RF performance
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Low dielectric loss
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Superior thermal shock resistance
Low Temperature Co-fired Ceramic (LTCC)
Multilayer ceramic technology for high-frequency and 3D integration.
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3D integration capability
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Excellent high-frequency performance
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High component density
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Embedded passive components
Ceramic Material Comparison
Key properties of different ceramic substrate materials
Property
Alumina (96%)
Aluminum Nitride
Beryllium Oxide
LTCC
Thermal Conductivity (W/mK)
24-28
170-200
250-300
2-5
Dielectric Constant @ 1MHz
9.0-9.5
8.5-9.0
6.5-7.0
5.0-8.0
CTE (ppm/°C)
6.5-7.5
4.5-5.5
7.5-8.5
5.0-7.0
Flexural Strength (MPa)
300-350
300-350
200-250
150-200
Max Operating Temp (°C)
1500
1800
1800
850
Ceramic PCB Manufacturing
Specialized manufacturing processes for ceramic circuit boards
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Substrate Preparation
Precision cutting and surface preparation of ceramic substrates with laser or diamond tools.
02
Metallization
Thick film or thin film metallization processes using screen printing, sputtering, or plating.
03
Firing Process
High-temperature firing in controlled atmosphere furnaces to bond metallization layers.
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Laser Processing
Precision laser cutting, drilling, and scribing for vias, cavities, and final dimensions.
Technical Capabilities
Our manufacturing capabilities for ceramic PCB production
0.05mm
Min Line Width
Minimum trace width on ceramic
0.05mm
Min Line Spacing
Minimum trace spacing
0.1mm
Min Via Size
Minimum via diameter
0.1mm
Via Pitch
Minimum via center spacing
0.25-1.5mm
Substrate Thickness
Available ceramic thickness
Ceramic PCB Advantages
Key advantages over traditional PCB materials
High Thermal Conductivity
Superior heat dissipation (10-20x better than FR-4)
Thermal Stability
Stable performance from -55°C to +850°C
Excellent Insulation
High dielectric strength and low loss
Mechanical Strength
High flexural strength and rigidity
Chemical Resistance
Resistant to solvents, acids, and bases
Ceramic PCB Products
Advanced ceramic PCB manufacturing for extreme applications
Power illumination PCB
Power Lighting PCBs are printed circuit boards (PCBs) used in power and lighting equipment
Deep Ultraviolet (DUV) purifier PCBs
Deep Ultraviolet (DUV) purifier PCBs are specialized circuit boards designed to power and control UV-C disinfection…
FAQ
What certifications do PCB factories have?
All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
How many layers is a Ceramic PCB？
According to the different needs, different processes, our factory can do ceramic circuit boards, can do the traditional process layer 2-8 layers, using low temperature co-fired ceramic (LTCC) and high temperature co-fired ceramic (HTCC), can reach 10-20 layers, or even higher. In actual application we will choose according to the customer, the type of process required and demand.
Commonly used ceramic circuit board processes
Using the common ceramic circuit board thick film process, it is an advanced printed circuit board manufacturing technology with the advantages of easy multi-layer wiring, low cost, high temperature resistance, corrosion resistance, good mechanical strength, etc., which is widely used in the fields of electronics, communications, aerospace and so on.
Is it possible to produce a ceramic PCB with only a picture and no Gerber file?
We can't produce without gerber file, we produce based on Gerber. Or if you have any samples, we can also clone based on the samples, if so, we can send 3-5 samples to our company, and then evaluate the price of making samples for you.
What is your delivery time?
The fastest delivery time we can support is 12 hours. 1 hour for prompt quotation. 4 hours for prompt engineering. This depends on your product requirements and quantity. In addition, lead time will be included in your quote.
Where are your circuit boards manufactured?
As a global PCB manufacturer, our factories are located in Guangzhou, China and Shenzhen, China, utilizing the strengths of each region to best serve you.
Latest News
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