Le circuit imprimé en céramique est un type de circuit imprimé fabriqué en utilisant un matériau céramique comme substrat, qui présente une excellente résistance aux températures élevées, une grande force d'isolation et un faible coefficient de dilatation thermique.
Avantages des circuits imprimés en céramique
1.
Plage de température de fonctionnement : -55°C à 850°C (matériaux HTCC)
Insulation strength: ≥15 kV/mm (Al₂O₃ substrates)
CTE: 6.5-8.5 ppm/℃ (matching Si/SiC chips)
2. Material Performance Advantages
| Material Property | AlN Substrate (Aluminum Nitride) | Al₂O₃ Substrate (96% Alumina) | BeO Substrate (Beryllia) | Measurement Standard |
|---|
| Thermal Conductivity | 180-220 W/mK | 20-30 W/mK | 250-300 W/mK | ASTM E1461 |
| Dielectric Constant @1MHz | 8.8 ±0.2 | 9.8 ±0.3 | 6.7 ±0.2 | ASTM D150 |
| Flexural Strength | 350 MPa | 300 MPa | 250 MPa | ISO 14704 |
| CTE (25-300°C) | 4.5 ppm/°C | 7.2 ppm/°C | 7.5 ppm/°C | ASTM E228 |
| Volume Resistivity | >10¹⁴ Ω·cm | >10¹⁴ Ω·cm | >10¹⁴ Ω·cm | IEC 60093 |
| Maximum Operating Temp | 850°C | 500°C | 900°C | MIL-PRF-55342 |
3. Surface Characteristics
Advanced Manufacturing Processes
Thin Film Process (DPC)
Thick Film Process (DBC/AMB)
Copper foil thickness: 100-300μm
Bonding strength: DBC(15-20MPa) vs AMB(>80MPa)
Operating temperature: AMB up to 1000°C
Co-firing Technology
LTCC: Sintering temp 850-900°C
HTCC: Sintering temp 1600-1800°C
Layer alignment accuracy: ±25μm
Fields of application
Power electronics: Ceramic circuit boards excel in power electronics and can withstand the demands of high-power-density circuit designs.
Automotive: In automotive electronic systems, ceramic circuit boards are used for reliable operation in harsh environments, especially under conditions of high temperature and high humidity.
Aerospace: Ceramic circuit boards are also widely used in aerospace applications due to their excellent high-temperature resistance and mechanical properties.