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Parameter Copper Foil Standard Advanced
Conductor (Trace Width)
18 μm 0.125 mm 0.100 mm 0.075 mm
35 μm 0.200 mm 0.150 mm 0.150 mm
70 μm 0.300 mm 0.250 mm 0.250 mm
105 μm 0.350 mm 0.300 mm 0.300 mm
140 μm 0.400 mm 0.350 mm 0.350 mm
210 μm 0.500 mm 0.450 mm 0.450 mm
Trace Spacing (Gap)
18 μm 0.125 mm 0.100 mm 0.075 mm
35 μm 0.200 mm 0.150 mm 0.150 mm
70 μm 0.300 mm 0.250 mm 0.250 mm
105 μm 0.350 mm 0.300 mm 0.300 mm
140 μm 0.400 mm 0.350 mm 0.350 mm
210 μm 0.500 mm 0.450 mm 0.450 mm
Annular Ring
Standard - 0.10 mm 0.075 mm
HDI - 0.075 mm 0.05 mm
Mechanical Drilling
Min Diameter - 0.20 mm 0.15 mm
Min Pitch - 0.30 mm 0.25 mm
Aspect Ratio - 8:1 10:1
Laser Microvias
Min Diameter - 0.10 mm 0.075 mm
Min Pitch - 0.20 mm 0.15 mm
Stacked Vias - Yes Yes
Staggered Vias - Yes Yes
HDI Structures
1+N+1 - Yes Yes
2+N+2 - Yes Yes
3+N+3 - On Request Yes
Board Thickness
Minimum - 0.2 mm 0.15 mm
Standard Range - 0.4–3.2 mm 0.4–4.0 mm
Maximum - 6.0 mm 8.0 mm
Copper Thickness
Inner Layers - 0.5–3 oz 0.5–6 oz
Outer Layers - 1–3 oz 1–6 oz
Layer Count
Standard - 1–16 1–24
Maximum - - 32
Impedance Control
Standard - ±10% ±7%
Precision - ±7% ±5%
Solder Mask
Min Clearance - 0.10 mm 0.075 mm
Colors - Green/Red/Blue Any (Pantone)
Silkscreen
Min Line Width - 0.15 mm 0.10 mm
Board Dimensions & Accuracy
Min Size - 5×5 mm 5×5 mm
Max Size - 500×600 mm 600×1200 mm
Accuracy - ±0.1 mm ±0.05 mm
Material Category Parameter / TG Description Application Cases
Standard & High TG (FR-4)
Material Type FR-4 Standard FR-4 High TG FR-4 Low Loss
Manufacturers Shengyi / KB / NanYa Isola / Panasonic Rogers (Hybrid)
Tg (°C) 130–140 170–180 180+
DK (1GHz) 4.2–4.5 4.0–4.3 3.5–4.0
DF 0.015–0.02 0.010–0.015 0.005–0.010
Operating Temp -40 ~ 105°C -40 ~ 130°C -55 ~ 150°C
High Frequency (RF / Microwave)
Rogers Series RO4003C RO4350B RT5880
DK 3.38 3.48 2.20
DF 0.0027 0.0037 0.0009
Applications RF / 5G Antennas High-speed Data Radar / Microwave
Specialty Substrates
Aluminum Base 0.5–3.0 mm, Thermal conductivity 1–3 W/mK
Copper Base High Power / LED Lighting / Automotive Power
Ceramic (Al2O3 / AlN) Ultra-high Temperature, Power RF
Flex PCB (FPC) PI / PET, 1–6 layers, dynamic flexing
Rigid-Flex Hybrid construction, 2–12 layers
Surface Finishes
HASL (SnPb) Standard Low cost solution Not for fine-pitch BGA
HASL Lead-Free RoHS Compliant Eco-friendly alternative Pitch > 0.5 mm
ENIG Ni 3–6 μm Au 0.05–0.1 μm Flat surface, most popular
ENEPIG Ni/Pd/Au Ultra-high reliability Gold wire bonding
OSP Organic Protection Cost-effective Limited shelf life
Immersion Silver Ag 0.1–0.3 μm Excellent conductivity Environmentally sensitive
Hard Gold Au 0.5–2 μm Contact connectors High durability & cost
Design Parameter Minimum Value Recommended Technical Note
Core Routing Guidelines
Min Trace Width 0.075 mm ≥ 0.10 mm HDI capable of 0.05 mm
Min Spacing 0.075 mm ≥ 0.10 mm HDI capable of 0.05 mm
Min Annular Ring 0.05 mm ≥ 0.075 mm Standard through-hole
Min Drill Size 0.15 mm ≥ 0.20 mm Mechanical drilling range
Aspect Ratio ≤ 10:1 8:1 optimal Affects plating reliability
BGA & Fine-Pitch Components
BGA Pitch 1.0 mm Standard Through-hole via Traditional breakout
BGA Pitch 0.65 mm HDI Microvia technology Increased layer count
BGA Pitch 0.4 mm Adv. HDI Via-in-pad (Vip-po) Filled & Capped Vias
Via-in-Pad Supported Resin filled Surface planarization required
High-Speed & Impedance
Differential Pairs 100Ω / 90Ω ±10% std Tight tolerance ±5% avail
Single-Ended 50Ω Matched length Critical for SI analysis
Backdrill Supported Via stub removal Improves signal integrity
Compliance & Quality Standards
IPC Class Class 2 Class 3 Industrial / Medical / Aero
Certifications UL / RoHS ISO 9001 / 14001 IATF 16949 (Automotive)

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