Seamlessly integrating flexible and rigid substrates to eliminate connectors, reduce weight, and maximize space in high-performance electronics.
From static flex-to-install to complex dynamic folding multilayer systems
Combining multiple rigid areas with several flexible layers. Ideal for complex medical devices and industrial controllers.
Designed to be folded once for installation in tight enclosures, reducing overall assembly time and connector points.
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Engineered for continuous bending applications like hinges or scanner heads with high cycle counts.
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Integrating Blind & Buried vias within hybrid constructions for the ultimate high-density interconnect requirements.
Our manufacturing limits for hybrid Rigid-Flex boards
Understand the performance advantages of hybrid interconnection
| Feature | Rigid PCB | Flexible PCB | Rigid-Flex |
|---|---|---|---|
| 3D Space Usage | Limited (Flat) | Excellent (Foldable) | Best (Self-Supporting) |
| Reliability (Vibration) | Medium | High | Excellent (No Connectors) |
| Component Support | Excellent | Moderate | Full (on Rigid sections) |
| Weight Reduction | Low | High | Optimal Hybrid |
Complex sequential lamination and precision etching for hybrid boards
Preparing the polyimide flexible cores with copper etching and coverlay application to define the bending sections.
Sequential lamination of rigid FR-4 layers onto the flex core using specialized "No-Flow" prepreg to prevent resin leakage.
Mechanical and laser drilling across different substrates followed by plasma desmear for plating reliability.
Outer layer circuit definition, surface finish, and 100% E-test/AOI for signal integrity across all interfaces.
High-reliability hybrid solutions for medical, aerospace, and wearable tech
All of our products are IPC rated with ISO 14001; ISO 9001; CE; ROHS certificates, etc. Our products are widely used in communication, medical equipment, industrial control, power supply, consumer electronics and aerospace, automotive industry and other fields.
Rigid zone: usually 4-20 layers (up to 30 layers), flexible zone: 1-8 layers (multi-layer flexible structure), can also do 6-12 layers of rigid-flex combination (e.g., 6 layers rigid + 2 layers flexible) typical structure of the board, the actual number of layers need to be verified by DFM simulation, more than 16 layers of the design need to be additionally assessed for the loss of yield (every additional 5 layers, the yield decreased by 8-12%).
We can copy the board, but we can't evaluate the batch quantity, and we can't offer the price directly, because we don't know the model and brand of the devices on the PCB board, and we need to give the corresponding price according to the later production process, the brand and model of the assembled electronic components, and the production quantity.
Our pricing structure is transparent with no hidden fees. Our prices are among the most competitive in the world. In the case of PCBs, quotes can be made in as little as 10 minutes, based on the difficulty of the boards, the quoting time will be different.
Generally, we will ask the customer if he/she needs to quote the shipping price for his/her reference before quoting. If so, we will ask the courier company's price according to the address and zip code, and the weight of the product, and then quote the price.
Design guides and trends for Rigid-Flex and Hybrid PCB technologies
Reduce assembly errors and space requirements with integrated Rigid-Flex solutions. Our engineers provide expert DFM feedback for hybrid stackups.