Advanced PCB — Inquiry Form
High-TG, HDI, High-Frequency, Thick-Copper — fill in your specifications for a personalised quotation
1
Upload Files2
PCB Specs3
Advanced Options4
Contact & Submit
Upload Attachment Files
Gerber files, stackup notes, impedance requirements, or other design files
Drag & Drop Files Here
Supports ZIP, RAR, PDF, Gerber, CSV, XLS, XLSX and other design files
Max 50 MB per file
For advanced PCBs, please include your Gerber files, stackup drawing, and any impedance requirements. Files are sent as email attachments to our engineering team.
PCB Specifications
Configure your advanced PCB requirements
Through Hole Board
Standard multilayer PCB with through-hole vias. Suitable for most advanced applications.
HDI Blind/Buried
High Density Interconnect with buried and/or blind vias for compact, high-performance designs.
HDI boards require a detailed stackup drawing specifying via types (blind/buried/micro) and layer interconnect structure. Please upload this with your Gerber files.
Dimensions & Quantity
mm
×
mm
pcs
Layer Count
Base Material
Trace & Drill
Surface Finish & Coating
Solder mask, silkscreen, surface treatment, and copper weight
Surface Finish
Copper Weight
Advanced Options
Via covering, edge connector, impedance, blind/buried vias
Special Requirements
Contact Information
We will send the quotation to your email address