Blog

Looking for a trusted PCB manufacturer in Germany? TOPFAST PCB offers over 17 years of experience, delivering high-quality, IPC-compliant PCBs for automotive, industrial, and medical applications.

Looking for a reliable PCB manufacturer in Canada? TOPFAST PCB provides high-quality, cost-effective solutions with over 17 years of experience. Serving Canadian companies with IPC-compliant manufacturing and fast delivery.

This guide explains PCB failure analysis, detailing common issues like CAF, delamination, and via cracks. It covers key inspection methods and effective prevention strategies for reliable electronics.

This article outlines key PCB failure analysis techniques, including cross-sectioning, X-ray inspection, thermal stress testing, and electrical analysis. These methods help effectively identify and diagnose the root causes of circuit board failures.

Cracked vias and barrel cracks are frequent PCB failures. This article explores their root causes, detection techniques, and the preventive measures manufacturers employ to ensure reliability.

CAF failure is a latent reliability issue in PCBs where conductive filaments form, causing short circuits. It stems from moisture, ionic contamination, and voltage. Detection involves electrical testing and microscopy, while prevention relies on optimized materials, design, and manufacturing processes.